for flying probe test of electronic boards.

The VIVA management software automatisms maximize the system’s capability to detect all possible faults. Advantages include:

Automatic creation of the test program

Automatic creation of the boundary scan program also for the non JTAG-type nets

Automatic elimination of test redundancies

Automatic error diagnostic

Single test report in VIVA environment

The X90 is configured to optimally x-ray BGA’s, QFN’s, Flip Chip technology, and Electronic Sealed Assemblies for solder joint quality, voids, failure analysis, quality assurance and process verification. 3 Axis joystick control of the internal tray table allows for oblique/angular viewing of components.

BGA Measurements – Automated Inspection, Diameter Deviation, Voiding, Skew/Offset, Gray Values, Shape, Pass/Fail Reporting

Image Processing – Manual/Automatic Contrast, Pseudo 3D, Distance (Point to Point), Histogram, Wire Sweep, Image Storage, Text & Markers, Multiple Image Screen, and Image Comparison

Percent Void Measurements – Automatic Alignment, Total Void Area, Total Void Percent, Largest Void, and Largest Void Percent

Indexing Table – 20″ x 18″ board size, X-Y-Z Rotation/Tilt, Programmable Position with Variable Zoom

between the two in order to ensure it can withstand changing temperatures in the harshest and most unpredictable real-world environments.

Temperature cycles from -68°C to 177°C (-90°F to 350°F)

Holds boards up to 26” in length and width and can stack to 26” in height

Data logger records and reports entire temperature cycle

from complex, densely populated PCBAs to simple LED strips.

Yet it remains easy to learn and use, enabling technicians to quickly and confidently master precision alignment, delicate placement, and precise heating control.

25 x 25 mm to 460 x 460 mm. It has a solder pot capacity of 15.9 Kg, while the flux tank can hold 1 litre.

The heating time required to melt the solder is 60 minutes, after which it can attain temperatures up to 400°C using a PID temperature controller. The conveyor can transfer PCBs from left to right or right to left at a speed of 0.127 m/sec within a soldering area of 460 x 460 mm. The spray fluxer has a diameter between 6-20 mm, while the solder wave height can be 6 mm. The N2 gas used to heat the solder is exhausted via a nozzle of 1.5 to 20 mm diameter, at a pressure of 5.5 bar. The gas consumption is 40CFH, and its temperature can be controlled around 0-400°C.

The Vector 460 is designed for high mix, high value, entry to mid volume PCB production. It can be programmed in minutes, to handle basic to complex dip, drag, wire bond, and other through-hole soldering processes. This system employs servo motion control for speed, accuracy, and repeatability. It is available in an enclosure that measures 2184 x 1803 x 1702 mm, and requires an AC supply from 208 - 240 V.

with a superior closed loop temperature sensor capable of delivering and maintaining a tip temperature with industry leading stability and accuracy.

Complete with a 180W Power Supply, a newly redesigned Solder Feeder, 4-Axis Motion, Adjustable End Effector, and a High Efficiency Solder Tip Cleaning Station, this system is more than capable of handling even the most challenging Soldering Application.

The overall machine footprint size is reduced, but with the design of the gantry allowing for more work space, the machine features a more than capable 300mm x 300mm Range of Motion.

volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy board loads.

Wide process window for “universal profiling” – allows many different boards to be run on a single temperature profile.

Advanced 5 thermocouple PCB profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs. With a high-capacity, 26-inch wide heater module, the 1800 Mark III series reflow oven offers unmatched flexibility in PCB handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/mesh belt combo, to carry even the largest PCB boards or multi-board panels (up to 20 inches wide) through the oven.

us to build through-hole and mixed technology boards fast and accurately.

Universal 6241B Axial inserter w/ 40 reel sequencer 10.

Universal DIP Inserter.

current standard of coherent jet technology to clean under tightly spaced components.

AAT further improved this technology by developing Progressive Energy Dynamics (PED), which is only available on Austin American In-line Cleaners. The MicroJet EC® is a fully capable water-only in-line cleaner including pre-wash, power wash, final rinse, and displacement drying. Austin American’s MicroJet® Cleaner is equipped with a patented displacement drying system which minimizes energy consumption and ionic residues left on boards and provides the fastest drying performance available. The MicroJet EC® In-line Cleaner comes standard with an integrated Closed Loop System which over its life will save thousands of gallons of water and kilowatts of power, which translates into a quick payback on this machine.